Sony’s new Playstation 5 revision model has seen its heatsink go from a large chunk, to a bit of metal. Austin Evans and his team purchased a Playstation 5 from Japan carrying the new revision number CFI-1100B and compared to the previous CFI-1015B. The teardown went part by part to identify the changes and everything was suspicious early on with earlier comparisons showing that the new Playstation 5 is lighter and its air vent is exhausting 3-5*C hotter.
Upon further teardown it was revealed that the primary culprit for the heat increase and weight reduction is a massive change in the cooling solution on the Playstation 5. As seen in the screenshot above, the one on the left is the new PS5 while the one the right is beefier heatsink on the older version. This means that Sony, for reasons undisclosed, chose to thermally gimp the new Playstation 5 and cutdown on its heatsink materials. While no in-depth testing was done, increased heat will always affect longevity.
More coverage on this will surely pop-up and we’ll keep you updated on further developments.
Leave a Reply