CES 2022 will officially kick-off in less than 6 hours as of this posting and AMD is set to lead the event with their keynote discussing current and upcoming technologies that they will reveal. Many have already speculated what they were launching so this bit of news is just confirming that ahead of time.
A leaked slide of AMD’s presentation later today lists their mobile line-up featuring Ryzen Zen3+ CPUs built on a 6nm node and with TDPs of up to 45w. The launch line-up will be segment into an H-series and U-series breakup with all high-performance H-series models having Zen3+ while U-series have a mixed offering. The other important bit to note here is that AMD has also integrated RDNA2 into their mobile CPU which should give us a glimpse of future AMD Zen3+ APUs for desktop.
AMD will have eight H-series mobile CPUs and a total of five U-series, 3 of which will be Zen3-based on the lower end of the stack. The top CPU will be the Ryzen 9 6980HX, an 8-core/16-thread CPU with a 3.3Ghz base clock and a maximum 5Ghz boost clock. All CPUs will have 20MB or 19MB of cache barring the Zen3 CPUs. As mentioned, these will be part of AMD’s Zen3+ offering and are built on a 6nm process.
The CPUs will support DDR5 support, USB4 as well as PCIe Gen4 support.
The new Zen3+ CPUs will feature RDNA2 IGPs and will be clocked in around 2.2 to 2.4Ghz. The Ryzen 9 and Ryzen 7 mobile CPUs will have 12 GPU cores and the Ryzen 5 parts will have six GPU cores running at 1.9Ghz.
Leave a Reply